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NTMFS4701N
Power MOSFET
30 V, 20 A, Single N ? Channel,
SOIC ? 8 Flat Lead Package
Features
? Thermally and Electrically Enhanced Packaging Compatible with
Standard SOIC ? 8
? New Package Provides Capability of Inspection and Probe After
Board Mounting
? Ultra Low R DS(on) (at 4.5 V GS ), Low Gate Resistance and Low Q G
? Optimized for High Side Control Applications
? High Speed Switching Capability
? These are Pb ? Free Devices
Applications
? Notebook Computer VCORE Applications
? Network Applications
? DC ? DC Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Typ
6.0 m W @ 10 V
8.0 m W @ 4.5 V
N ? Channel
D
G
I D Max
20 A
Rating
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
S
S D
4701N
S
AYWZZ
S
G
D
D
Gate ? to ? Source Voltage
Continuous Drain Current
(Note 1 )
Power Dissipation
(Note 1)
Continuous Drain Current
(Note 2)
Power Dissipation
(Note 2)
Steady
State
t v 10 s
Steady
State
t v 10 s
Steady
State
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
V GS
I D
I D
P D
P D
I D
P D
$ 20
12.3
9.8
20
2.3
6.0
7.7
6.2
0.9
V
A
W
A
W
1
SOIC ? 8 FLAT LEAD
CASE 488AA
STYLE 1
4701N = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
MARKING DIAGRAM &
PIN ASSIGNMENT
D
Pulsed Drain Current t p = 10 m s
Operating and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 25 V, V GS = 10 V, I PK = 7.5 A,
L = 10 mH, R G = 25 W )
I DM
T J , T stg
I S
E AS
60
? 55 to
150
6.0
280
A
° C
A
mJ
ORDERING INFORMATION
Device Package Shipping ?
NTMFS4701NT1G SOIC ? 8 FL 1500 / Tape & Reel
(Pb ? Free)
NTMFS4701NT3G SOIC ? 8 FL 5000 / Tape & Reel
(Pb ? Free)
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 in from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 in sq. pad size
(Cu area 1.127 in sq. [1 oz} including traces).
2. Surface ? mounted on FR4 board using minimum recommended pad size
(Cu area 0.412 in sq.).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 4
1
Publication Order Number:
NTMFS4701N/D
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